Hot Bar Reflow Soldering & Bonding

Hot Bar Reflow Soldering & Bonding is a process of tightly bonding metal wire and metal welding area through heating and pressure. Its principle is to use high temperature and pressure to cause plastic deformation of the metal in the welding area, destroy the oxide layer, and generate atomic attraction to achieve bonding.  ‌

Core principle

Soften the metal surface by heating, while applying pressure to promote interatomic bonding. After high-temperature damage to the oxide layer, metal atoms enter the atomic gravity range through plastic deformation, forming metallurgical bonds.  ‌

Application field

Commonly used in semiconductor packaging, circuit board connections, and other fields, such as bonding metal leads to chip pads or packaging frames to ensure electrical connection reliability.  ‌